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Manufacturers of CMP polishing pads and cleaning solutions, polyimide (PI) pastes for flexible OLEDs, and colored polymer toners have built the only wafer CMP polishing pad production and research base in China

The integrated circuit chip has a key process, chemical mechanical polishing, which needs to be repeated up to 128 times. International advanced chip manufacturers have used 7-nanometer process technology, and 1-nanometer is equivalent to one-sixth of a strand of hair, and the difficulty can be imagined. In the past, CMP polishing pads, the key materials used in domestic polishing, almost all depended on imports.

HBDL Holdings Co., Ltd. invested nearly 400 million yuan. After 6 years of hard research and development, it has completed the only domestic and internationally advanced integrated circuit chip CMP polishing pad. Production and research base, and assume the national "02 special project".

Polishing the Chips and “Bottoming Up” Flexible Screens in the Optoelectronics and Semiconductor Industries

In November 2018, the Ministry of Industry and Information Technology and the Ministry of Finance announced the list of the first batch of national new materials production and application demonstration platforms for construction projects. HBDL Co., Ltd., as the only company in China with key materials for integrated circuit manufacturing, CMP polishing pad process technology and industrial production Capable companies were selected together with 18 other integrated circuit industry leaders.

In recent years, Wuhan has vigorously developed the “core screen end network” industry, and production lines of Yangtze River Storage, BOE, Tianma, and Huaxing Optoelectronics have landed one after another, forming an industrial cluster with the largest investment scale, the highest technical requirements, and the most complex industrial support in Wuhan. Dinglong Co., Ltd. is one of the few upstream key material R & D and suppliers with an early layout (starting to set foot in 2012) and has gradually realized industrialization. It has built the only domestic and international advanced integrated circuit chip CMP polishing pad. Production and research base and China's first flexible polyimide paste production line for OLED. According to industry evaluations, Dinglong has broken the global monopoly of foreign companies for many years, and can effectively promote the localization of materials required by China's semiconductor integrated circuit industry and panel display industry.

Polishing is to ensure better performance and structural stability of the chip. CMP polishing pads are the key materials for the "neck neck" in the wafer chip manufacturing process. Previously, the production technology was mainly controlled by several large companies such as the United States and Japan. One of the global top 500 companies monopolized 85% of the market share.

CMP is chemical mechanical polishing. It refers to the technology of flattening the wafer using chemical and mechanical forces during the wafer manufacturing process. The wafer manufacturing process requires repeated use of the CMP process. This process is like building a building. Each layer is covered, and the structure needs to be polished to ensure that the structure is stable. The integrated circuit has achieved 128 layers and can be polished up to 128 times. CMP technology can achieve global planarization of the wafer, and is currently the most effective and widely used planarization technology. The mechanical properties and surface texture characteristics of the polishing pad are critical to the planarization effect, and are the core of the technology and value of the CMP process.

Aiming at the “industrial segmentation of related industries that are urgently needed but also dependent on imports”, we focus on new material products with high technological thresholds. "

The same goes for optoelectronic display industry. Flexible displays represent the future direction of displays. In order to achieve "flexibility", a flexible display polymer substrate instead of a glass substrate, polyimide (PI paste) is the key. There are multiple steps in the manufacturing process of OLED flexible display. PI paste is applied at the bottom layer. Its role is to replace the key material of OLED bottom glass. After superimposing TFT light-emitting materials and display materials on it, it is deposited and evaporated. , Annealing and other high-temperature processes of more than 400 degrees Celsius, laser peeling into a thin film.

At present, almost all of the PI slurry depends on imports. Wuhan Rouxian, a subsidiary of HBDL Co., Ltd., has independently developed the product and has passed the evaluation of an OLED production line of a well-known domestic panel manufacturer. Its first 1,000-ton large-scale PI slurry production line in China Under construction, it will be completed this year.

Since its development, HBDL Co., Ltd., as a high-tech innovation listed company, has continuously "filled the shortcomings" and "filled in the blanks" in the field of domestic substitution.

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