Mitsubishi Chemical has developed a new epoxy resin that combines high heat resistance and low viscosity through a new production method. In recent years, the industry has seen a continuous trend of miniaturization of equipment and wiring. Not only that, as the automotive industry moves towards electrification, the requirements for high heat resistance are becoming higher and higher, so the new epoxy resin can be said to be perfect Catering to current needs.
As a major player in this field, Mitsubishi Chemical offers a variety of epoxy resins. It is particularly worth mentioning that the company's YX4000 series, whose viscosity is only 0.2 poise, is the de facto standard for semiconductor packaging materials. When molding underfill (MUF) materials, it is necessary to insert a sealant between the bumps, and since the space between the bumps has now been reduced to tens of microns, the use of low viscosity epoxy becomes critical .
At the same time, as the automotive industry develops towards electrification, the demand for epoxy resins in automotive applications continues to increase, resulting in a growing demand for heat resistance levels that current consumer products do not have. In particular, the materials surrounding the engine are required to withstand temperatures of approximately 100-150 degrees Celsius.
However, it is impossible for traditional production methods to combine high heat resistance with low viscosity. Mitsubishi Chemical's new epoxy resin has high heat resistance-a glass transition temperature of 200 degrees Celsius-and also matches the 0.2 viscosity low viscosity of the YX4000 series. As a result, the trade-off between high heat resistance and low viscosity is eliminated.
In addition to electronic applications-including semiconductor sealants, laminates and injection molding materials-this new epoxy resin will also be introduced for composites, structural adhesives and other wide applications. The current goal is to establish a mass production system for the material as soon as possible.