In 2015, an innovative industry-university research exchange event was staged at the iENA Nuremberg International Invention Exhibition in Germany. In this grand event, one of the three major invention exhibitions in the world, the current CTO Dr. Zhang of TWKS Electronic Materials Technology Corporation led the R&D team to win the gold medal at the International Invention Exhibition with "Antioxidant Conductive Copper Paste and Application".
In addition to the characteristics of high heat dissipation and high conductivity, copper also has a cost advantage, so it is called the "mother of industry". Not only does it have a pivotal position in the industry, it is also the first choice to replace other precious metal materials in many other fields. Taking the wire bonding process of semiconductor packaging as an example, the packaging leader ASE Technology Holding used copper as early as 2008 Replacing the gold wire will not only bring amazing cost-effectiveness, but also establish their leading position in the global packaging industry.
Although copper materials have great advantages, they are easily oxidized and become the fatal disadvantage of copper oxide (poor electrical and thermal conductivity), and even the conductive paste market has been unable to successfully find a solution. The conductive paste market has been almost dominated by silver paste for a long time, and its price fluctuates with international futures prices. The search for an alternative to silver paste has become a key goal that the entire industry must break through.
This problem was quickly solved after TWKS launched the nano high heat dissipation conductive copper paste solution. This not only breaks the semiconductor conductive paste market dominated by silver, but also a self-developed nano-copper conductive copper paste led by the TWKS team.
Nano conductive copper paste is used in chip packaging, and has the advantages of good workability, excellent adhesion, and excellent heat dissipation and conductivity.
Demonstrates the greatest advantage of excellent heat dissipation capacity to meet the needs of high power and thin IC packaging
Dr. Zhang said that in the production of antioxidant nano-copper powder, the company uses special chemical reactions and an exclusive antioxidant protection formula, which can effectively use special techniques to inhibit crystal growth and successfully produce antioxidant nano-copper powder. After mixing the antioxidant nano copper powder with a non-toxic and environmentally friendly formula, a nano high heat dissipation conductive copper paste is produced. This product can still exhibit superior oxidation resistance even in a high temperature and high humidity environment, its excellent electrical conductivity, high heat dissipation capacity and high adhesion, and then show the superior performance of conductive copper paste.
With the demand for laminated technology and thin ICs, the heat dissipation problem has always been the focus of current IC packaging efforts to overcome. "The biggest advantage of TWKS anti-oxidation nano copper paste lies in its excellent heat dissipation." Dr. Zhang pointed out, TWKS The product can respond to customers, provide customized copper pastes that meet different heat dissipation requirements, and can also meet the extreme heat dissipation conditions required by high-power ICs such as automotive electronics.
The thermal conductivity of mainstream silver paste is about 2-5 W/mK. The thermal conductivity of TWKS's standard basic copper paste is as high as 15 W/mK, and the high-end model can reach 30-60 W/mK. In the future, it will be more towards 100W~ 200W ultra-high heat dissipation copper paste is developed to meet the heat dissipation needs of various extreme conditions in the future.