AVIENT launched a new generation of Edgetek™ 3D/LDS solutions in Asia. This material is specially developed for 3D molded interconnect components (MID) for laser direct structuring (LDS), which can meet the requirements of high design flexibility, integration of multiple functions, miniaturization and light weight.
According to AVIENT, the technology uses polycarbonate (PC), polyphenylene sulfide (PPS) and liquid crystal polymer (LCP) as the base material to design formulas and can be customized according to the specific needs of customers.
"Using MID can continuously enhance the integration of electronic and mechanical functions, and can meet the challenges faced by many industries and markets; that is, seek simple and lightweight solutions without affecting production efficiency and increasing costs," AVIENT Xu Tao, general manager of the Special Engineering Materials Division in Asia, said, "Our 3D/LDS technology can meet the growing demand of the market, with fewer steps in the processing process, shorter assembly time, and higher cost-effectiveness."
At present, MIDs using 3D technologies such as LDS have been widely used in various fields such as antennas (consumer electronics), auto parts, medical equipment, and 5G base stations. Even in high-temperature manufacturing processes such as SMT (Surface Mount Technology), the new Edgetek formula can help electronic component manufacturers reduce the size of mechanical and electronic (also known as mechatronics) systems.