On the morning of March 19th, the signing ceremony of the precision semiconductor silicon material project of Hemeng Precision Industry Co., Ltd. was held in Hefei Economic Development Zone. The total investment of the project is 30 million US dollars. It is mainly engaged in the production and manufacturing of key silicon parts and silicon rings and wafers in semiconductor etching process equipment.
United Alliance Precision is a joint venture established by Taiwan Hanmin Technology and Japan Shiji Technology Co., Ltd. In the later period, Japan's Mitsubishi Materials also plans to participate in the investment. The total investment of the project is 30 million U.S. dollars. It is mainly engaged in the key silicon components in semiconductor etching process equipment-silicon rings and wafers Production and manufacturing, supporting the world's second largest semiconductor equipment company Japan Toden Electronics.