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Swiss exaddon electrochemical deposition technology achieves μAM ultra-high resolution, can realize nano metal 3D printing ultra-micro parts

An ultrafine micro-nano-grade metal 3D printing company emerged in Switzerland. Their CERES 3D printing system is specifically designed for researchers and scientists to perform 3D printing microfabrication (μAM) of metals on the micron scale.

CERES can print complex miniature metal objects with nanometer resolution at room temperature, ranging from 1 μm to a maximum of 1000 μm (human hair is generally 80 to 90 microns), and no post-processing is required.

Metal 3D printing microfabrication technology (μAM) is based on electrochemical deposition, the principle is:

Immerse a small 3D printing nozzle called iontip into the suspended electrolyte; precisely adjust the air pressure to push the liquid containing metal ions into the micro channel inside the ion head. Liquid flow is very small-as low as soaring per second. At the end of the microchannel, the ionic liquid is released onto the 3D printed surface. The dissolved metal ions are then electrodeposited as solid metal atoms.

These metal atoms grow together as voxels in small parts. Optical force feedback records the completion of 3D printing of each voxel until all voxels are printed and a complete object is constructed. The electrochemical 3D printing process is performed at room temperature, which can produce very high-quality metal structures, and can be directly applied without any post-processing. In the opinion of Antarctic Bear, this technology is extremely innovative and has great application potential in the field of micro-fine processing and manufacturing.

Optically measure the force acting on the ion tip nozzle, and feedback it back to the system in real time, and then process control. This allows you to detect which voxels of the model object have been 3D printed.

CERES micro-nano metal 3D printer

CERES is an independent system that can 3D print complex pure metal objects with micron and submicron resolutions. In addition, it supports liquids and nanoparticles made of different materials.

CERES combines nano-scale precise positioning, gas-driven liquid distribution, electrochemical deposition, and optical force feedback. The latest operating system already has CAPA software and has an intuitive graphical user interface that can seamlessly connect all parts of the system. Crucially, CERES can print at room temperature without post-processing. It can print overhanging parts without a supporting structure. This capability is very different from other metal additive manufacturing technologies.

In order to ensure high-precision printing, the system is equipped with two high-resolution cameras with computer-aided alignment. It also supports automatic ion pickup loading and 3D printing structure video visualization.

Device parameters:

The standard 3D printing platform dimensions are 15×15 mm and 25×25 mm. Customized molding platform up to 100×70 mm

Up to 200 μm / s processing speed

XY ± 250 nm and Z ± 5 nm positioning accuracy

Applications:

Microcoil

Manufacturing coils with a diameter of less than 300 microns is a complex and difficult challenge for industry and scientific research, and traditional methods can hardly solve it. Thanks to the electrochemical deposition 3D printing micro-fabrication technology, the use of standard printing nozzles can achieve a coil diameter reduced to 10 microns. Using custom nozzles, the diameter can be smaller. This is a collaborative project between Harvard Medical School and Exaddon.

Technical application advantages:

Printed directly on the contact surface

Provide multiple designs

Support pure copper

Excellent conductivity

More complex designs are feasible:

-Plane coil

-Winding multiple coils

-Strands can have different diameters

Microchip package

Microchips are getting smaller and smaller, and packaging processes are often the limiting factor in reducing the total number of packages. There is a fundamental need to rethink how to connect and control the die, and how to connect the die to the PCB or other active die area.

With the help of the CERES system, tiny conductive traces can be printed and bridges between different areas can be achieved. It is possible to realize connectors and contact posts with diameters and shapes that are not possible with other technologies.

Science and Basic Research

It has been shown that the behavior of micro- and nano-polymer structures differs from that of their macro counterparts. However, for metal objects, it is still full of unknowns, with many uncertainties and research opportunities.

With the help of the CERES system, pure metal microstructures with complex geometries can be 3D printed, so that the behavior of metal objects can be better understood at a very small scale. It also allows the study of a variety of new materials and nanoparticles, and opens up a whole new field of vision for the field of electrochemistry.

advantage:

Made entirely of metal with high mechanical properties

Unprecedented design freedom

Controllable merge and split of parts

Allows testing of custom architectures for best shock absorption and other performance

High frequency technology

The demand for high-speed communications and information access has led to an increasing demand for bandwidth. High bandwidth means high frequency and short wavelength. Short wavelength means slim antenna and structure;

Using electrochemical deposition micro-nano metal 3D printing technology, you can enter the THz range and create tiny antennas that cannot be achieved by any other technology;

The micro-processing technology using the CERES system can achieve terahertz and maintain the global leading position.

Chip broken defect repair

Increasing output in chip production is one of the most enduring goals of microchip manufacturers. However, during the functional and performance testing of microchips and chips, new products may be damaged due to failure; in most cases, products with poor performance or damage are classified and scrapped.

The use of CERES system, especially the use of μAM technology, can repair damaged defects directly on the die. The high-precision resonance circuit can be leveled by adding connecting lines between different chip areas.

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