"The technical difficulty of the chip is largely due to the extremely small size of the lowermost aperture and the extremely difficult filling. The latest technology has reached the level of 2 nanometers. And 2 nanometers is about one-third of the diameter of a human hair." SHXY Shi Xiaochao, director of the Technology Center of the Semiconductor Materials Technology Group, introduced that the "Damascus Copper Interconnect Plating Additive" innovatively developed by SHXY has solved the problem of insufficient development in the field of key materials for integrated circuits in China and broke the technological highland where only 2-3 foreign companies had monopolized before. , To fill the domestic technological gap. "Damascus copper interconnect electroplating additives will be widely used in domestic wafer manufacturing plants in the future, realizing domestic substitution."
Chip copper interconnect electroplating solution is the core process material in the field of chip manufacturing, and the domestic market has long been dependent on imports. The chip manufacturing process has very strict requirements on the production environment and chemical materials. Related chemical certification needs to pass rigorous, harsh and long procedures. Semiconductor manufacturers are very cautious in the selection of suppliers. Only after at least 2 years of verification and qualification, Only then will a stable supply relationship be formed. The prudent and strict verification process constitutes an obstacle to the promotion of new entrants, but once the supplier enters the semiconductor manufacturer's supply chain system, it will establish first-mover advantage and market barriers.
Through-Silicon-Via (TSV, Through-Silicon-Via) is an advanced technology for forming vertical metal vias on chips or wafers through etching and electroplating processes to achieve interconnection between chips. TSV technology is the key technology of 3D IC, which greatly shortens the interconnection distance between wafer and wafer, chip and chip, improves the stacking density and integration of the chip in the three-dimensional direction, and greatly improves the calculation of the chip Speed, electrical transmission performance, TSV packaging has become one of the focus of the semiconductor packaging industry.
SHXY has developed chemicals including 3D IC-TSV, chip copper interconnect electroplating solution and additives, and all technical indicators of the products are at the international leading level. TSV technology has been widely used in CMOS image sensors and other chips. With the continuous improvement of TSV technology and the reduction of cost, it is expected to be applied to 3D ICs, logic chips, memory chips, etc.
SHXY's copper interconnect electroplating solution has now entered the SMIC 28nm and Hynix 32nm baseline machines. The products have passed the product certification of SMIC, Wuxi Hynix, Suzhou Jingfang, Kunshan West Titanium and other customers, and entered the SMIC’s "centralized liquid supply system" has so far accounted for more than 80% of its purchases in this category in Beijing Plant 1, Plant 2 and Shanghai Plant 2. It is SMIC's chip copper interconnect electroplating solution product. The first supplier. At present, the company's ultra-pure electroplating solution products can cover the 28nm technology node and become SMIC's benchmark material, with a consumption of more than 50%.