XAJG Optoelectronic Materials Technology Corporation is committed to the R&D and manufacturing of high-performance Diode Laser Materials.
AuSn Pre-Deposited AlN Ceramic Substrates/AMC
As the submount for the heat dissipation of high-power diode laser chips, the AuSn pre-deposited DPC material is fabricated through metallization of AlN ceramic substrate and pre-deposition of micron-level AuSn thin film in specific areas. It is a key technology that ensures the long-term reliable use of optoelectronic devices.
AuSn Pre-Deposited CuW Substrates/AMM
As the submount for the heat dissipation of high-power diode laser bar chips, the AuSn pre-deposited CuW material is fabricated through pre-deposition of micron-level AuSn thin film in specific areas of copper-tungsten substrates. It is a key technology that ensures the long-term reliable use of optoelectronic devices.
Applications
Telecommunication
Fiber Laser Pumping Components
