The deep processing of precious metal gold into gold bonding wires with a diameter accuracy of up to 0.01mm is the core competitiveness of SZZB Semiconductor Materials Technology Group.
SZZB is committed to the research and development and production of precious metal nanomaterials, integrated circuit semiconductor packaging materials, 5G mobile communication new materials, and bonding wires for semiconductor sealing and testing new materials.
At present, the company has a research and development center in Europe, three large production bases in China, a thousand level dust-free factory workshop, 40 production lines, and an annual output value of 10 billion yuan.
In 2022, the company's high-end bonding wire has a market share of over 15% in China.
As the only enterprise in China with a full range of semiconductor bonding wire products, SZZB's bonding wire products cover series such as gold bonding wire, silver alloy bonding wire, and gold/rake/copper alloy bonding wire.
Gold bonding wire product is a type of gold wire with a gold content greater than 99.99%, which combines the excellent properties of gold, silver, and palladium. Its performance is the most stable, and it can connect chips and external frameworks to achieve conductor connectivity. It can be used in high-end and high priced products such as LED and smart card packaging. In addition, the manufacturing techniques of silver alloy wire, bonded silver wire and other products are also very mature, and are mostly used for semiconductor IC packaging and integrated circuit packaging.