GZLJ is committed to providing high-performance thermal managements solutions for the following fields:
smartphones, tablets, AR/VR, electric vehicles, robots, communication switches, data center servers, and high computing power chip cooling packages, as well as extreme heat dissipation and cooling application scenarios…
GZLJ is the first and only company that integrates two phases (liquid phase and gas phase) and double circulation (internal circulation and external circulation) into actual products.
The world's thinnest two-phase flow cycle steam chamber technology (PWS/MagicWick lnside VC), four season uniform temperature plate technology (FSVC) with different working fluid two-phase flow cycles, and the world's highest heat dissipation power 3D two-phase flow cycle steam chamber embedded liquid cooling heat dissipation technology (Niujin cold pump liquid cooling radiator)…
Technology Platform and Patent
GZLJ has over 100+ patent innovations and proprietary technologies categorized into 4 portions covering new material, new design, new process and new architecture.
PWS
Print Wick Structuring (PWS) technology for making ultra-slim (<0.25mm) vapor chamber device in high performance, high yield rate, low cost and high production automation.
Cooling Engine
The Novel Cooling Engine (NLC) is a three dimensional vapor chamber device with heat dissipation fins. With the NeoGene Cooling Engine as the core, NeoGene Liquid Cooler, NeoGene Immersion Dissipator and NeoGene Package Module have been developed for liquid cooling applications.
Two phase flow circulation vapor chamber with different working fluids.
A multiple channels vapor chamber panel with water-based two phase flow circulation and coolant-based two phase flow circulation mixing together. The two phase flow circulation in the vapor chamber can be efficiently working at high and low temperature scenarios.
Liquid Cooler
With the advancement of semiconductor technology and chip design capabilities, the computing power of the chip has been greatly improved, and the thermal design power of the single-chip is also required to increase from 300W to 500W, or even more than 1,000W.
GZLJ Liquid Cooler provides a complete chip cooling solution, from 300W to 1,500W.
Cooperating between internal high efficiency two phase flow circulation and external liquid circulation,GZLJ Liquid Cooler will be able to explore any possibilities of ultra-high-power heat dissipation.
Immersion Dissipator
With the advancement of semiconductor technology and chip design capabilities, the computing power of the chip has been greatly improved, and the thermal design power of the single-chip is also required to increase from 300W to 500W, or even more than 1000W.
GZLJ Immersion Dissipator provides a complete chip cooling solution, from 300W to 1,500W.