SZHP Electronic Material Technology Cooperation is committed to R&D and production of high-end electronic paste.
The current main business includes a full range of products such as gold paste, silver paste, platinum paste, silver palladium paste, silver platinum paste, tungsten molybdenum manganese paste, copper nickel paste, resistance paste, insulation paste and dielectric paste for thick film circuits, multilayer chip components and high and low temperature co fired ceramic components.
It can be applied to alumina, aluminum nitride, ferrite, microwave ceramics, glass, PET/PI and other different matrix materials.
It is finally applied to the production of capacitors, resistors, inductors, ceramic packaging substrates, gas sensors, piezoelectric, pressure sensitive, thermal sensitive, photoelectric, flexible electronics and other components.
The company has a strong technical research and development team, including 8 senior doctors and 13 masters in the industry, who have worked in electronic paste research and development institutions or production enterprises for many years.
Through years of continuous innovative research and development, the company's R&D team has made several breakthroughs in three key technical problems: controllable preparation of special precious metal powder, control of co sintering shrinkage, and reliability of thick film circuit mixing.
Especially, it has many core technical advantages in low-temperature co fired LTCC supporting gold and silver mixed system, high-temperature co fired HTCC oxygen sensor platinum paste system, and microelectronic packaging HTCC tungsten/molybdenum/manganese electronic paste.
The company has formed more than 50 kinds of stable electronic paste products, and has fully independent and controllable technology research and development strength from precious metal powder to electronic paste, as well as product batch supporting ability, to ensure the safety and controllability of the industrial chain.