On January 2, 2020, nano-silica manufacturer JSHG invested about 1 billion yuan to build a composite silicon fine powder project with an annual output of 33,000 tons of copper clad laminates.
As a filler, silicon fine powder has advantages in heat resistance, dielectric properties, linear expansion coefficient, and dispersion in resin systems, due to its high melting point, small average particle size, low dielectric constant, and high insulation Therefore, it is widely used in the copper clad laminate industry. In the current industry practice, the resin filling ratio is about 50%. The filling rate of silicon micropowder in resin is generally 30%, that is, the filling weight ratio of silicon micropowder in copper clad laminate can reach 15%.