A few days ago, Toray DuPont stated that they will explore the market demand for polyimide (PI) film "Kapton" in 5G communication applications and newly developed a three-layer structure that can be used in flexible printed circuit boards (FPC) Co-extruded PI film products.
The company claims that the new product suitable for FPC is to form an adhesive layer of thermoplastic PI resin on both sides of the thermosetting PI film, that is, a co-extruded film with a three-layer structure. At present, the product has been established in mass production at the Tokai Plant in Aichi Prefecture, and samples have been sent to clients. It is expected to be put on the market in 2019.
Since the adhesive layer has been set in advance, the manufacturer only needs to apply copper foil on both sides, and it can be directly used for FPC applications. And because the three layers are all made of PI resin, it can highlight the characteristics of PI resin, and it is expected to further reduce the thickness, heat resistance, and improve dimensional stability of FPC.
In addition, the new products also enhance the electrical characteristics that are important for 5G communications. Toray DuPont uses low-dielectric products in the PI film and adhesive layer, and optimizes the overall design to achieve a comprehensive low-dielectric film and adhesive layer.
For FPC applications, Toray DuPont plans to expand its market towards special grade applications suitable for 8K imaging. In addition, Toray DuPont will also develop applications for applications that also have large capacity and high-speed communication requirements, including vehicles, base stations, and data centers.
It is understood that Toray DuPont Co., Ltd. was established in June 1964, of which 50% of the shares are owned by Toray, and 50% of the shares are owned by DuPont. On April 28, 2017, according to the Chemical Industry Daily, as the competition in the PI film market continued to intensify, Toray DuPont will begin to reorganize the PI film business unit. The company's move is not only to ensure profitability in global competition, but also to respond to the growing trend of PI film in flexible substrate (FPC) and other markets.
In addition, Toray Co., Ltd. announced on May 30 that they have developed a PI (polyimide) material suitable for 5G communication, which can be widely used as a high-speed and stable communication technology for transmitting large amounts of data, and For millimeter-wave radar electronics for automatic operation. This material combines PI's heat resistance, mechanical properties, and adhesion characteristics with the low dielectric loss performance required for high-speed communications to better improve the performance of high-frequency components used in these constructions.
Toray said that they have adopted years of high-performance PI design technology, and through precise molecular design, they have met the low dielectric loss conditions, and the power loss has been suppressed to 0.001 (20GHz.).