Ube Industries has developed a high thermal conductivity heat dissipation material composed of copper and graphite, which can effectively dissipate the heat generated by semiconductors in electronic and communication equipment. The thermal conductivity is the silicon nitride and nitride of the heat sink material. 3 times that of aluminum and 2 times that of copper. The thermal conductivity is 800W/m.k, which is the world's top level.
This new material is jointly developed with AKANE, which has an exclusive sintering technology. Different from the general electric sintering method of heating and pressing up and down, it adopts the "multi-axis electric sintering" technology of pressing up and down and heating in the horizontal direction. Due to heating and pressing from multiple directions, the powder can be sintered and solidified uniformly. The sintered graphite crystals are neatly arranged and exhibit high thermal conductivity. In addition, because it contains soft copper, it is easy to process, and its specific gravity can be as light as silicon nitride and aluminum nitride. The coefficient of thermal expansion is similar to that of silicon nitride, aluminum nitride, silicon, silicon carbide (SiC), and gallium nitride (GaN). As a heat dissipation material, when joined with the above materials, the difference in thermal expansion coefficient between materials can be reduced Causes peeling problems.
With the increase in performance of small electronic devices such as smart phones, the use of electrical equipment in automobiles and home appliances, and the popularization of high-speed/large-capacity 5G communications, the demand for heat dissipation measures is indeed rising. According to the Fuji Economic Survey, the global market for heat dissipation components including heat dissipation substrates will reach 321.4 billion yen in 2023, an increase of 25.8% compared with 2018. In the future, with the electrification of automobiles, the popularization of autonomous driving, and the transformation of 5G communication providers, the demand for heat dissipation materials is expected to expand in one fell swoop.