On April 1, ASM Pacific Technology Co., Ltd.'s total investment of 300 million US dollars in the ASM semiconductor material project was formally signed and settled in Jiujiang City, Jiangxi Province. The successful signing of the project is a major breakthrough for Jiangxi Province's industrial investment. Xie Yiping, Mayor of Jiujiang City, Luo Wenjiang, Deputy Mayor, Secretary of the Party Working Committee of Jiujiang Economic Development Zone, Xu Hongmei, Vice Chairman of the CPPCC, Xu Jingmin, Chief Operating Director of ASM Pacific Technology Co., Ltd., Zhou Quan, Executive Vice President, and senior management attended the signing ceremony. Zhu Yuanfa, a member of the party group and deputy director of the Provincial Department of Commerce, delivered a speech and witnessed the signing of the contract.
The introduction of ASM Pacific Technology Co., Ltd., the world's largest semiconductor integrated packaging equipment and material manufacturer, to build a semiconductor material project in Jiujiang City will not only help the company's material business to become the world's first mid-to-long-term goal, but also It fills the blank of Jiujiang's semiconductor material packaging industry, injects a strong impetus to improve the city's electronic information industry chain, extend and expand the industrial chain, and accelerate the development of industrial clusters.
It is reported that ASM Pacific Technology Co., Ltd. (ASMPT) was founded in 1975 and listed in Hong Kong in 1989 (stock code H0522). It is the world's largest supplier of integration and packaging equipment for the semiconductor and light emitting diode (LED) industry. There are more than 30 countries and regions in the world, with 10 outstanding locations in Hong Kong, Chengdu, Taiwan, Singapore, Munich and Regensburg, Germany, Weymouth, England, Buningen, Portugal, Porto, and Bill Rica Research Center. There are 12 advanced intelligent manufacturing centers in Shenzhen Baoan, Shenzhen Longgang, Guangdong Huizhou, Hong Kong, Singapore, Malaysia and Germany. Since 2002, it has become the first in the industry, occupying a global leading position in the fields of semiconductor integration and packaging equipment market, SMT solution, RF application market, lead frame industry and other fields.